3612
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
3612 is a gold conductor paste designed use in chip and wire bonding applications and for use in manufacturing multilayer interconnection circuitry. 3612 fires to a dense, pin-hole free film.
Key Features
Excellent Au wire bondability
Dense fired film
Dense fired film
Metal
Au
Viscosity
210 – 250 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Coverage
65-70 cm 2
/gm
(Calculated from 50 micron wet film)
/gm
(Calculated from 50 micron wet film)
Coverage
65-70 cm 2
/gm
(Calculated from 50 micron wet film)
/gm
(Calculated from 50 micron wet film)
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
325 stainless steel mesh screen
0.3-0.6 mil emulsion
Allow parts to level at room temperature for 10 -15
minutes before drying, but parts should be dried as soon
as possible after leveling. Wet parts should be covered if
not dried right away.
0.3-0.6 mil emulsion
Allow parts to level at room temperature for 10 -15
minutes before drying, but parts should be dried as soon
as possible after leveling. Wet parts should be covered if
not dried right away.
Printing Speed
Up to 15 cm/sec (6 in/sec)
Drying Temperature
150C for 5-10 minutes
Process Temperature (TDS)
850°C to 950°C peak temperature
Dwell time of 5-10 minutes at peak
Dwell time of 5-10 minutes at peak
Film Thickness
Fired 8-14 microns