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5223
5223
Paste Type:
Conductor
Substrate:
Glass
Application Method:
Brushing
Application:
Hybrid IC
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Details
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Description & Key Features
Description
5223 is a low firing fritted platinum/silver conductor paste. It exhibits excellent solderability on glass substrates.
Key Features
Low firing temperature
Excellent solderability
Paste Properties
Metal
AgPt
Viscosity
23 – 28 Kcps Brookfield RVT
SC4-14 spindle and 6R utility cup
at 10 rpm, 25 °C
Storage and Paste Preparation
Store in a dry location at 5 – 25 °C
Warranty
6 months
Processing
Drying Temperature
150 ºC for 15 minutes
Process Temperature (TDS)
600 – 650 ºC peak temperature
Dwell time 10 minutes at peak
Cycle time of 45 minutes