C1076SD

Description

C1076SD (LPA609-022) is a low-cost Ag/Pt conductormaterial that utilizes an oxide bond system for providing particularly excellent adhesion to alumina and beryllium oxide substrates. The material can easily be used to print fine line patterns or large-area ground planes and features all the advantages of a fritless system. Resulting film is dense and uniform.

Key Features

Excellent solderability and leach resistance
Solderable on alumina
Compatible with HERAEUS resistors
Excellent initial and aged adhesion Inner layer for multilayer applications
Very good conductivity
Aluminum and gold wire bondable

Metal

AgPt

Viscosity

30 – 50 Pa·s (25°C, D = 100/s)

Coverage

80 cm2/g (FFT: 12 μm)

Coverage

80 cm2/g (FFT: 12 μm)

Storage and Paste Preparation

Store in a dry and cool condition at 2 – 23°C in a dark place with container tightly shut. When stored in a refrigerator, the paste should reach room temperature before being opened.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

Print through a 200 – 325 mesh stainless steel screen. Total thickness: 50 – 110 μm

Printing Speed

Up to 20 cm/s

Drying Temperature

Dry at 150 °C for 10 - 20 minutes

Process Temperature (TDS)

Fire at 850 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30 – 60 minutes

Film Thickness

12.5 – 15.5 μm