C2290P
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing,Stencil Printing
- Application: Hybrid IC
Details
Description
C2290P is a screen or stencil printable, silver palladium 9:1 paste designed as a hole plug in alumina substrates. The high solids loading allows excellent filling properties. C2290P has low shrinkage, which allows a complete fill of the through hole.
Key Features
High solids loading
Low shrinkage
For use in a print process
Low shrinkage
For use in a print process
Metal
AgPd
Viscosity
15 – 25 Pa·s
(25°C, D = 100/s)
(25°C, D = 100/s)
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 3 months from date of manufacturing with proper storage.
Drying Temperature
Dry at 150 °C for 10 - 20 minutes.
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30 – 60 minutes.