C4003
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C4003 is a 3/1 Ag/Pd thick film conductor material that isboth solderable and heavy gauge aluminum wire bondable. This product was developed for use in harsh environments, such as under-the-hood automotiveapplications.
Key Features
Excellent solderability
High aged adhesion
Good AI wire bond adhesion (initial and aged)
Good thermal cycled and autoclave adhesion
High aged adhesion
Good AI wire bond adhesion (initial and aged)
Good thermal cycled and autoclave adhesion
Metal
AgPd
Viscosity
150 – 200 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup, @ 10 rpm, 25°C
Coverage
100 cm2/gm at 12 μm fired film thickness
Coverage
100 cm2/gm at 12 μm fired film thickness
Storage and Paste Preparation
Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280 mesh stainless steel screen
0.5 mil emulsion
0.5 mil emulsion
Drying Temperature
150 °C for 10 minutes
Process Temperature (TDS)
Fire at 850 °C peak temperature10 minutes at peak temperature Dwell time of 10 minutes at peak
Film Thickness
10 – 14 μm