C4082 is a Ag/Pd/Pt formulation which provides outstanding leach resistance and aged adhesion with many types of solder. This material has excellent silver migration resistance. C4082 prints and holds 5 mil lines and spaces.
Key Features
Excellent Ag migration resistance High coverage Outstanding leach resistance
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280 stainless steel mesh 0.5 mil emulsion
Drying Temperature
150°C for 10 minutes
Process Temperature (TDS)
850 °C peak temperatureDwell time of 9 – 11 minutes