C5007
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C5007 is a wire bondable gold conductor, containing a mixed bonded Au formulation.It has been formulated to be resistant to blistering after multiple firings, also when fired together and Ag/Pd conductor Series of C2000.
Key Features
Compatible with the recrystallizable HERAEUS dielectrics
IP9117 Series Excellent aged wire bond adhesion and contact resisitivity properties
IP9117 Series Excellent aged wire bond adhesion and contact resisitivity properties
Metal
Au
Viscosity
30 – 90 Pa·s (25°C, D = 75/s)
Coverage
c. 50 cm2
/ g (FFT: 9 µm)
/ g (FFT: 9 µm)
Coverage
c. 50 cm2
/ g (FFT: 9 µm)
/ g (FFT: 9 µm)
Storage and Paste Preparation
Store in a dry and cool condition at 2 – 23°C in a dark place with container tightly shut. When stored in a refrigerator, the paste should reach room temperature before being opened.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
Print trough a 200 – 325 mesh screen.
Level at room temperature for 10 minutes.
Level at room temperature for 10 minutes.
Printing Speed
Up to at least 10 cm / s
Drying Temperature
Dry at 150°C for 10 - 20 minutes.
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30 – 60 minutes
Film Thickness
6 – 12 μm