C5730

Description

C5730 is a gold conductor paste that has been formulated for use with AI or AU wire bond applications on AI2O3 and AIN.

Key Features

Excellent AI and Au bondability
High conductivity
Good adhesion on AI2O3 and AIN

Metal

Au

Viscosity

280 – 380 Kcps Brookfield HBT SC4 – 14 spindle, 6R cup at 10 rpm, 25 °C

Coverage

72.0 – 75.0 cm2
/g at 22 – 25 μm wet film thickness

Coverage

72.0 – 75.0 cm2
/g at 22 – 25 μm wet film thickness

Storage and Paste Preparation

Store in a dry location at 5°C-25°C

Warranty

6 months

Printing Parameters

280 – 325 mesh stainless steel screen
0.3 – 0.5 mil emulsion

Drying Temperature

150 °C for 10 minutes
Make sure ventilation is sufficient to prevent the wet film from
skinning

Process Temperature (TDS)

850 °C peak temperature, 10 minutesat peakTotal cycle time 45 – 60 minutes

Film Thickness

8 – 10 μm