C5730
- Paste Type: Conductor
- Substrate: Aluminum Nitride (AlN), Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C5730 is a gold conductor paste that has been formulated for use with AI or AU wire bond applications on AI2O3 and AIN.
Key Features
Excellent AI and Au bondability
High conductivity
Good adhesion on AI2O3 and AIN
High conductivity
Good adhesion on AI2O3 and AIN
Metal
Au
Viscosity
280 – 380 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Coverage
72.0 – 75.0 cm2
/g at 22 – 25 μm wet film thickness
/g at 22 – 25 μm wet film thickness
Coverage
72.0 – 75.0 cm2
/g at 22 – 25 μm wet film thickness
/g at 22 – 25 μm wet film thickness
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280 – 325 mesh stainless steel screen
0.3 – 0.5 mil emulsion
0.3 – 0.5 mil emulsion
Drying Temperature
150 °C for 10 minutes, Make sure ventilation is sufficient to prevent the wet film from skinning
Process Temperature (TDS)
850 °C peak temperature, 10 minutesat peakTotal cycle time 45 – 60 minutes
Film Thickness
8 – 10 μm