C5735

Description

C5735 is a gold conductor paste that has been formulated for use with Au wire bonding applications. C5735 is a screen printable paste that gives an extremely dense and defect-free fired film. Fine lines are able to be printed down to 75 μm lines and spaceswith etching possible for ultra-fine features down to 25 μm.

Key Features

Excellent Au bondability
High conductivity
Fine line printing Etchable (Chemical and laser)

Metal

Au

Viscosity

300 – 530 kcps, Anton Paar Physica MCR101, CP25-1, 4sec-1, 25°C

Coverage

118 cm2/g @ 10 µm fired film
thicknes

Coverage

118 cm2/g @ 10 µm fired film
thicknes

Storage and Paste Preparation

Refrigerate at 1 – 5°C to ensure shelf life. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

325 – 400 mesh stainless steel screen
0.3 – 0.5 mil emulsion
1.1 mil wire

Drying Temperature

150 °C for 10 minutes, Make sure ventilation is sufficient to prevent the wet film from skinning

Process Temperature (TDS)

850 °C peak temperature, 10 minutes at peakTotal cycle time of 45 – 60 minutes

Film Thickness

Wet: 22 – 28 µmDry: 11 – 15 µmFired: 6 – 10 µm