C8709P
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Stencil Printing
- Application: Hybrid IC
Details
Description
C8709P is a screen printable, pure silver paste designed as a hole plug in alumina substrates. The high solids loading allows for excellent filling properties. C8709P has low shrinkage, which allows for a complete fill of the through hole.
Key Features
High solids loading
Low shrinkage
For use in a print process
Low shrinkage
For use in a print process
Metal
Ag
Viscosity
300 – 650 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 3 months from date of manufacturing with proper storage.
Drying Temperature
150 °C for 15 minutes
Process Temperature (TDS)
850 °C peak temperature
Dwell time of 8 – 12 minutes at peak_x000D_
Dwell time of 8 – 12 minutes at peak_x000D_