C8729
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C8729 is a plateable silver conductor that yields a smooth, dense film. It exhibits high adhesion on alumina substrates. C8729 can be multiple fired without any loss of performance. C8729 is an excellent choice for electrolytic plating applications, such as copper, nickel, tin, etc.
Key Features
Low resistivity
High adhesion
High speed printing
Feed through hole application
High adhesion
High speed printing
Feed through hole application
Metal
Ag
Viscosity
15 – 25 Pa·s
(25°C, D = 100/s)_x000D_
(25°C, D = 100/s)_x000D_
Coverage
c. 80 cm2
/g
(FFT: 12 µm)
/g
(FFT: 12 µm)
Coverage
c. 80 cm2
/g
(FFT: 12 µm)
/g
(FFT: 12 µm)
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
200 – 325 mesh screen
Printing Speed
Up to at least 20 cm/s
Drying Temperature
150 °C for 10 - 20 minutes
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 – 12 minutes, and with a total firing cycle time of c. 30 – 60 minutes
Film Thickness
Wet: 32 – 34 µmDried: 22 – 26 µmFired: 10 – 15 µm