C8829D
- Paste Type: Conductor
- Substrate: Aluminum (Al), Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C8829D is a low firing silver conductive paste. It was developed for the Celcion® system and exhibits increased solder leach resistance and improved solderability.
Key Features
Low firing temperature
Increased solder leach resistance
Improved solderability
AI wire bondable
Increased solder leach resistance
Improved solderability
AI wire bondable
Metal
Ag
Viscosity
150 – 200 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup, @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Process Temperature (TDS)
550 – 570 °C peak temperatureDwell time of 5 – 7 minutes
Film Thickness
12 – 20 μm