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- CL40-9056
CL40-9056
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Resistors and Fuses
Details
Description
CL40-9056 is a plateable Pd/Ag Conductor paste which exhibits high density, high reliability and good fine line definition, (5mil lines and spaces). It fires to a smooth surface and is mechanically durable and chemically resistant. CL40-9056 was designed to withstand Ni and Sn/Sn-Pb plating baths.
Key Features
Plateable
Smooth fired surface
Excellent solderability and leach resistance
Smooth fired surface
Excellent solderability and leach resistance
Metal
AgPd
Viscosity
180 – 240 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280-325 stainless steel mesh screen
0.5 mil emulsion, 1.1 mil wire
Let the print level at room temperature for 10 minutes
before drying.
0.5 mil emulsion, 1.1 mil wire
Let the print level at room temperature for 10 minutes
before drying.
Drying Temperature
150°C for 10 minutes
Process Temperature (TDS)
850°C peak temperature
Dwell time fir 10 minutes
Total cycle time of 30-60 minutes.
Dwell time fir 10 minutes
Total cycle time of 30-60 minutes.
Film Thickness
10-12 microns