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- DT1749L-1
DT1749L-1
- Paste Type: Component Metallization
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Resistors and Fuses
Details
Description
DT1749L-1 is a lead free silver paste for backside conductor of chip resistors, which with low silver content. DT1749L-1 exhibits excellent leaching property, acid-resistance property, adhesive property and electrical characteristics.
Key Features
Excellent leaching property
Excellent acid-resistant property
Excellent adhesive property
Excellent electrical characteristics
Excellent acid-resistant property
Excellent adhesive property
Excellent electrical characteristics
Metal
Ag
Viscosity
120 – 180kcps, Brookfield HBDV–III Ultra, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
200- 400 mesh
Polyester or stainless steel screen
Polyester or stainless steel screen
Drying Temperature
130 °C for 15 minutes, with exhaust system 150 °C for 10 minutes
Process Temperature (TDS)
Peak temp:840~860 °C
Dwell time:8~15 minutes
Dwell time:8~15 minutes