ET1801B is a solderable Ag/Pd/Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). It offers excellent solderability and leach resistance.
Key Features
Suitable rheology for machine dip application Excellent solderability and leach resistance Compatible on titanate ceramic bodies
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Process Temperature (TDS)
780 – 810 °C at peak temperature Dwell time of 5 – 6 minutes at peak