ET1826 is a solderable Ag/Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). ET1826 offers excellent solderability and adhesion. ET1826 is supplied at a viscosity suitable for machine dip and blot or no blot applications
Key Features
Suitable rheology for machine dip application Excellent solderability and adhesion Compatible on titanate ceramic bodies
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Process Temperature (TDS)
780 – 810 °C at peak temperature Dwell time of 5 – 6 minutes at peak