ET1826 is a solderable Ag/Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). ET1826 offers excellent solderability and adhesion. ET1826 is supplied at a viscosity suitable for machine dip and blot or no blot applications
Key Features
Suitable rheology for machine dip application Excellent solderability and adhesion Compatible on titanate ceramic bodies
Metal
AgPt
Viscosity
25 – 35 Kcps Brookfield RVT SC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C
Process Temperature (TDS)
780 – 810 °C at peak temperature Dwell time of 5 – 6 minutes at peak