Details
Description
ET1840 is a Pt/Pd/Ag conductor paste. It is a high density, high reliability material, which exhibits high leach resistance, with lower resistivity values. ET1840 is formulated to provide good conductivity while meeting the requirements of solderability, leach resistance, resistance to silver migration and high initial adhesion.
Key Features
Excellent solderability and leach resistance
Low resistivity values
Low resistivity values
Metal
AgPdPt
Viscosity
300 – 400 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Process Temperature (TDS)
850 °C peak temperatureDwell time of 8 – 10 minutes at peak
Film Thickness
11 – 15 μm