Details
Description
ET1856 is a solderable & nickel plateable silver/palladium (4:1) end termination designed to be compatible on Multilayer ceramic chip capacitors (NPO and X7R bodies). Nickel plating can be done without pre- plate processing due to the low glass content on the fired surface.
Key Features
Nickel plateable no pre-plate processing
Low usage excellent coverage uniformity
Dense fired mircotructure Cu plateable
Low usage excellent coverage uniformity
Dense fired mircotructure Cu plateable
Metal
AgPd
Viscosity
30 – 40 kcps, Brookfield RVT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Drying Temperature
150 °C for 10 minutes, 20 minute total cycle time
Process Temperature (TDS)
650 – 800 °C peak temperatureDwell time of 5 – 7 minutes at peak