ET2001 is a dippable polymer based silver end termination. It contains a fast curing polymer system. ET2001 is a Ni/Sn plateable polymer end termination designed to be compatible on multilayer ceramic chip capacitors (NPO and X7R bodies).
Key Features
Ni and Sn plateable Solvent resistant
Metal
Ag
Viscosity
40 – 60 Kcps Brookfield HBT SC4 – 14 spindle, 6R utility cup at 10 rpm, 25 °C