ET2010
- Paste Type: End Termination, Polymer Thick Film
- Substrate: MLCC
- Application Method: Dipping
- Application: Capacitors, LTCC
Details
Description
ET2010 is a dippable, polymer-based silver conductor formulated as a post termination layer. The flexible termination can be applied over previously terminated multilayer ceramic chip capacitors. ET2010 can also function in chip resistor and chip fuse applications where cost and reliability are a concern. This termination is Pb and Cd free, Ni/Sn plateable, and provides excellent flexibility for rigorous industry bend test standards.
Key Features
#Ni and Sn plateable#Solvent resistant#Room temperature stable#Low Ag content#Bend test flexibility ≥ 10mm
Metal
Ag
Viscosity
20 – 30 kcps, Brookfield HBT, SC4-14 spindle @ 10 rpm, 25°C
Storage and Paste Preparation
Store at ambient conditions away from direct light. Material should be thoroughly mixed or rolled on a jar roller at a slow speed for 1 hour prior to use.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.