Details
Description
ET2854 is a nickel plateable silver end termination designed to be compatible on Multilayer ceramic chips especially on alumina bodies. Nickel plating can be done without pre-plate processing due to the low glass content on the fired surface.
Key Features
Excellent adhesion property after plating Excellent hermeticity
Metal
Ag
Viscosity
40 – 50 Pa·s, Brookfield HBDV–III Ultra, SC4– 14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Drying Temperature
150 °C for 8 minutes Peak temp: 175 °C
Process Temperature (TDS)
630- 800°C peak temperature Dwell time of 5 – 7 minutes