IP6085
- Paste Type: Dielectric / Glaze
- Substrate: Aluminum (Al)
- Application Method: Screen Printing
- Application: Heaters
Details
Description
IP6085 is a single part dielectric paste which produces a
dense, grey, hermetic fired film. IP6080 is compatible
with 3000, and 6000 grade aluminum substrates. Its
unique glass system high breakdown strength up to 75 μm
of dielectric. It is compatible with C8829D Ag conductors.
dense, grey, hermetic fired film. IP6080 is compatible
with 3000, and 6000 grade aluminum substrates. Its
unique glass system high breakdown strength up to 75 μm
of dielectric. It is compatible with C8829D Ag conductors.
Key Features
Excellent electrical properties
High breakdown voltage
Compatible with Aluminum substrates
High breakdown voltage
Compatible with Aluminum substrates
Viscosity
40 – 80 kcps, Brookfield RV DV-III
# 14 spindle in utility cup @ 10
RPM, 25 ºC
# 14 spindle in utility cup @ 10
RPM, 25 ºC
Coverage
155 cm2/g @ 40 microns wet film
thickness
thickness
Coverage
155 cm2/g @ 40 microns wet film
thickness
thickness
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280 – 325 mesh stainless steel
screen
0.5 mil emulsion thickness
Allow wet prints to level at room
temperature for 10 minutes before
drying
Two individually fired layers or cofired layers with a total thickness
of at least 50 µm will be necessary
to achieve the optimum
performance level
screen
0.5 mil emulsion thickness
Allow wet prints to level at room
temperature for 10 minutes before
drying
Two individually fired layers or cofired layers with a total thickness
of at least 50 µm will be necessary
to achieve the optimum
performance level
Printing Speed
Drying Temperature
150 ºC for 15 minutes
Process Temperature (TDS)
570 ºC as measured on substrate
Dwell time of 2 - 20 minutes,
dependent on application/substrate
mass
Dwell time of 2 - 20 minutes,
dependent on application/substrate
mass
Film Thickness
22 – 28 µm (1 layer)13 – 17 µm (1 layer)40 – 50 µm (3 layer