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- PC10899
PC10899
- Paste Type: Component Metallization
- Substrate: PZT, NTC Ceramics, Alumina (Al2O3), Steatite, Porcelain
- Application Method: Screen Printing
- Application: Piezo, Component Metallization
Details
Description
PC10899 is a low temperature firing silver paste designed
to screen print solderable electrodes onto a variety of
electrical ceramic component devices. The fired film
forms a highly adherent bond to many types of substrates,
including piezo-electric transducers (PZTs), NTC
thermistors, alumina, steatite, and porcelain. The
metalized electrode is readily solderable for external lead
attachment.
to screen print solderable electrodes onto a variety of
electrical ceramic component devices. The fired film
forms a highly adherent bond to many types of substrates,
including piezo-electric transducers (PZTs), NTC
thermistors, alumina, steatite, and porcelain. The
metalized electrode is readily solderable for external lead
attachment.
Key Features
RoHS compliant*
REACH compliant**
Lower firing temperature (< 700°C)
Screen printable
Excellent solderability
Designed for piezo-electric transducers (PZTs),
NTC thermistors, alumina, steatite, and porcelain
REACH compliant**
Lower firing temperature (< 700°C)
Screen printable
Excellent solderability
Designed for piezo-electric transducers (PZTs),
NTC thermistors, alumina, steatite, and porcelain
Metal
Ag
Viscosity
80 – 100 kcps Brookfield HBT SC-14 spindle & 6R utility cup @ 10 rpm, 20°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
60-250 mesh stainless steel screen
0.7 -1.0 mil emulsion
Allow parts to level at room temperature for 10 minutes
before drying.
0.7 -1.0 mil emulsion
Allow parts to level at room temperature for 10 minutes
before drying.
Drying Temperature
100-150°C for 10-15 minutes
Process Temperature (TDS)
650-700°C peak firing temperature
Dwell time of 8-12 minutes at peak
Total cycle time of 45-60 minutes.
Larger parts may require a longer firing profile.
Dwell time of 8-12 minutes at peak
Total cycle time of 45-60 minutes.
Larger parts may require a longer firing profile.
Film Thickness
9 - 15 microns