PCC11970

Description

PCC11970 is a Pb and Cd free palladium silver conductor composition designed for use in the manufacture of hybrid circuitry. PCC11970 employs a mixed oxide and glass bonding system that results in a dense, solderable fired film with high initial and aged adhesion.

Key Features

Solderable fired films
Excellent initial and aged adhesion

Metal

AgPd

Viscosity

200 – 260 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Coverage

70-75 cm2
/gm
(calculated from 50 micron wet film)

Coverage

70-75 cm2
/gm
(calculated from 50 micron wet film)

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

200 - 325 mesh stainless steel screen
0.5 mil emulsion
Allow parts to level at room temperature for 1 – 3 minutes
before drying.

Printing Speed

≤ 25 cm/sec. (10 in/sec)

Drying Temperature

150°C for 5 - 10 minutes.

Process Temperature (TDS)

850°C peak temperature
Dwell time of 10 minutes at peak

Film Thickness

9-15 microns