ST3288P

Description

ST3288P is a low temperature firing silver conductor
paste designed for pad printing solderable
electrodes onto a variety of electrical ceramic
component devices. The fired film forms a highly
adherent bond to many types of substrates,
including piezoelectric transducers (PZTs), NTC
thermistors, alumina, steatite and porcelain. The
metalized electrode is solderable for external lead
attachments.

Key Features

REACH1 and ROHS2 compliant
Excellent adhesion
Low temperature firing (<700°C)
Compatible on piezoelectric transducers
(PZT), NTC thermistors, alumina, steatite and
porcelain

Metal

Ag

Viscosity

15 – 30 kcps, Brookfield RVT, Spindle #14 @ 10 rpm, 25°C

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Drying Temperature

100-150°C for 10-15 minutes

Process Temperature (TDS)

550 - 750C peak temperature
Dwell time 8-12 minutes at peak
Cycle time of 45-60 minutes
Larger parts may require a longer firing profile

Film Thickness

7 - 12 microns