T2100HP conductor paste is a thermosetting silver filled polymer. This material was designed for die attach and rigid circuit applications.
Key Features
#screen printable#For die attach and rigid circuit applications
Metal
Ag
Viscosity
250 – 300 Kcps; Brookfield HAT, spindle #14 @ 10 rpm, 25 °C
Coverage
60 cm2/g
Coverage
60 cm2/g
Storage and Paste Preparation
Store at ambient conditions away from direct light. Material should be thoroughly mixed or rolled on a jar roller at a slow speed for 1 hour prior to use
Warranty
6 months
Printing Parameters
Polyester Mesh (157 to 230 TPI) Steel Mesh (165 to 325 TPI)