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- T2100HP
T2100HP
- Paste Type: Polymer Thick Film
- Substrate: PET / Polyimide / PC
- Application Method: Screen Printing
- Application: Sensors
Details
Description
T2100HP conductor paste is a thermosetting silver filled polymer. This material was designed for die attach and rigid circuit applications.
Key Features
#screen printable#For die attach and rigid circuit applications
Metal
Ag
Viscosity
250 – 300 kcps; Brookfield HBT, Spindle #14 @ 10 rpm, 25°C
Coverage
60 cm2/g
Coverage
60 cm2/g
Storage and Paste Preparation
Store at ambient conditions away from direct light. Material should be thoroughly mixed or rolled on a jar roller at a slow speed for 1 hour prior to use.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
Polyester Mesh (157 to 230 TPI)
Steel Mesh (165 to 325 TPI)
Steel Mesh (165 to 325 TPI)
Drying Temperature
150°C
Film Thickness
12 µm, DFT