TO2002 is a Screen Printingable dielectric that can be co-fired with HL2000 to act as a solder mask. TO2002 has excellent adhesion to HL2000 and is impervious to most solvents, moisture and soldering.
Key Features
Solder mask for HL2000 tape Impervious to most solvents, moisture and solder
Metal
None
Viscosity
35 – 45 Kcps, Brookfield HBTviscometerSC4 – 14 spindle with 6R utility cup at 10 rpm, 25 °C
Process Temperature (TDS)
Co-fire with HL2000 Burnout and firing profile in a box oven. Ramp at 3 °C/min to 100 °C for start of burnout. Burnout: ramp at 2 °C/min to 450 °C (typically no holds are required during burnout). Ramp at 8.0-10 °C/min to 865 °C. Firing peak: 865 °C for 20-30 minutes. Cool at 10 °C/min to room temperature.