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- UVD5271
UVD5271
- Paste Type: Polymer Thick Film
- Substrate: FR4/PCB
- Application Method: Screen Printing
- Application: Sensors, Simple Circuits
Details
Description
UVD5271 is an UV curable solder mask, overcoat, or dielectric designed for rigid substrates. UVD5271 offers rapid curing combined with outstanding adhesion and resistance to solvents, moisture, and the soldering process. It is less sensitive to surface cleanliness than other UV curable materials. It offers excellent electrical and environmental integrity after soldering and cleaning, and outstanding line definition, typically >8 mils. Heraeus also offers a series of compatible, thermally cured conductors.
Key Features
#REACH and ROHS compliant#High adhesion to many industry common substrates#Excellent chemical and solder resistance#High insulating resistance and breakdown voltage
Metal
None
Viscosity
10 – 30 kcps; Brookfield HBT spindle #14 @ 50 RPM, 25°C
Storage and Paste Preparation
Ambient storage, mix well prior to use.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
250-280 mesh screen recommended
.5 mil emulsion
.02" snap-off distance
.5 mil emulsion
.02" snap-off distance
Drying Temperature
200°C
Film Thickness
12-25 µm DFT