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C7463LV
C7463LV
Paste Type:
Conductor
Substrate:
Alumina
Application Method:
Screen Printing
Application:
Hybrid IC
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Description & Key Features
Description
C7463LV is a stencil printable coper paste designed to fill through-holes in alumina substrates.
Key Features
High solids loading#Low shrinkage Stencil-printable
Paste Properties
Metal
Cu
Viscosity
250-375 Kcps Brookfield HBTSC4-14 spindle and 6R utility cup at 10 rpm, 25 °C
Processing
Process Temperature (TDS)
Fire in Nitrogen with O2 between 2-5 ppm 925 ºC peak temperature. Dwell time 5-10 minutes.