Silicon carbide (SiC) is enabling more compact, efficient and high-power inverters for high-voltage EV platforms. But as SiC devices become more standardized, competitive advantage is shifting from the chip alone to packaging that is reliable, economical and scalable.
Silver-containing brazing layers have long been the established choice for AMB substrates. Today, the rising demand for high-voltage power modules in EVs and data centres, combined with migration risk, high silver costs, price volatility and sustainability requirements, raises an important question:
Does silver still provide sufficient technical value to justify its use?
This whitepaper examines the role of silver in AMB substrates and presents the performance of a silver-free alternative. The results demonstrate that high-performance AMB substrates can be achieved without silver in the brazing layer. Silver-free AMB delivers automotive-grade reliability, integrates into existing manufacturing processes without redesign, eliminates silver migration and reduces dependence on a volatile precious metal while lowering the substrate's environmental footprint.
For OEMs and power module manufacturers, this opens up new opportunities to improve cost predictability, strengthen supply-chain resilience and support more sustainable vehicle platforms without compromising performance or manufacturing efficiency.
Explore the performance comparison and the technical and commercial implications in the full whitepaper.
