White Paper

Heraeus Electronics and AMX automatrix White Paper: Large area sintering for high performance power module packaging

Take an in-depth look at module attach sintering with this technical whitepaper written together with AMX automatrix.

Learn how Heraeus Electronics addresses the challenges of traditional power module packaging technologies with its mAgic® paste variants, PE360P and PE360D, designed for module attach applications. The paper, first published in Power Electronic News, highlights their excellent joint properties and remarkable reliability during thermal cycling tests, essential for enhancing power electronics designs.

The white paper covers:

  1. Large area silver sintering for future high reliability packages
  2. Heraeus mAgic® paste variants for large area sintering – PE360P and PE360D
  3. Introduce P201X HS as large area equipment
  4. Summary

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Large area sintering for high performance power module packaging

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