Heraeus Electronics - The One-Stop Partner For All Your Electronics Packaging Needs

Heraeus Electronics Technology (Suzhou) Grand Opening

Heraeus Electronics Technology (Suzhou) inaugurates new facility in Changshu, China, to serve emerging industries such as e-mobility and help China achieve dual carbon goals.

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Together for climate protection

Together with the local start-up and official partner of German city and state forests, Planet Tree, Heraeus Electronics has planted a total of 438 trees in German forests this year. Each tree helps capturing carbon dioxide from the atmosphere and makes an important contribution to protecting our climate.

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Application Note: Die Top System

Are you looking to elevate power modules to the next level? Together with Wolfspeed we have created an application note designed to guide you through the implementation of the innovative Die Top System (DTS®) in the production process. 

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2024 SEM Tech Days: Accelerating Our Future in the Silicon Desert & Silicon Hills

Read more about the Heraeus Electronics 2024 SEM Tech Days in the dynamic regions of Arizona and Texas.

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Heraeus Electronics and BASiC Semiconductor Sign Strategic Cooperation Agreement

Collaboration aims to jointly promote technological innovation and value enhancement in the power semiconductor industry.

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Thank you for joining us at Semicon Taiwan 2024

Do you want to find out more about the Heraeus Electronics Advanced Packaging Material Solutions or explore how our recycled materials such as reycled tin paste can help you minimizing carbon emissions?

Learn more about our Product Portfolio

Heraeus Electronics is a leading global manufacturer of materials for the assembly and packaging of devices in the Electronics Industry. The company develops material solutions for the Automotive, Power Electronics and Advanced Semiconductor Packaging market in eight development centers and production facilities in Asia, the USA, and Europe. As a solution provider, Heraeus Electronics offers a broad product portfolio - from materials and material systems to components and services for the Electronics Packaging and Component Industry.