Meet Heraeus Electronics at PCIM Expo 2026
We create lasting connections – live at PCIM Expo 2026
Join our booth from June 9th to 11th at hall 6, number 310 and discover the latest
advancements in Power Electronics.
Among the highlights will be the debut of mAgic® PE340 silver pressure sinter paste for dense packaging.It offers precise printing and defined edge formation for optimized material use. Multi-process compatibility - including printing, dispensing, and dry or wet placement – ensures seamless integration into production.
Heraeus Electronis will also showcase the new Microbond solder preforms which improve reliability over traditional alloys and uses Innolot® technology for lower melting temperatures. The latest Innolot® 2.0 reduces silver content while maintaining performance, supporting IGBT applications up to 150 °C junction temperature.
Connect with our experts to gain insights, discuss your challenges, and explore how our products and solutions can benefit your business.