Thermal Shock Temperature Lifetime Modeling of Large Area Sintered Silver Baseplate Modules
Discover groundbreaking insights into large area sintering (LAS) and its role in enhancing the reliability of sintered silver baseplate modules. This whitepaper provides a detailed study on thermal shock temperature lifetime modeling and the next generation of interconnection technologies for metallized ceramic substrates.
Advancing Large Area Sintering Technology:
Large area sintering is rapidly emerging as the preferred connection technology for high-power, high-efficiency, and high-reliability inverters. By replacing traditional soldering, sintered silver attachments deliver significantly improved performance and durability.
Research Highlights:
First presented at ECCE Europe 2024 in Darmstadt, Germany, and later published in SMT Today (October 2024), this study investigates the potential of innovative large-area sintered silver pastes for establishing highly reliable baseplate-to-substrate interconnections.
Key findings include:
- Evaluation of advanced AMB substrates (Condura®.prime) and cost-effective counterpart Condura®.ultra (AMB2.0) with comparable temperature shock test (TST) performance.
- Demonstration that sintered attachments can last up to 30 times longer than conventional soldered connections.
- Valuable insights into improving thermal cycling reliability and long-term stability of power electronic modules.
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Thermal Shock Temperature Lifetime Modeling of Large Area Sintered Silver Baseplate Modules