Meet Heraeus Electronics at PCIM Expo 2025!

Discover the latest advancements in Power Electronics with Heraeus Electronics at PCIM Nuremberg.

Among the highlights will be the debut of DTS® Silver, a next-generation Die Top System material designed for high-performance applications at an optimized cost.

Heraeus Electronics will also showcase Condura®.ultra, a silver-free AMB bonding technology for metal-ceramic substrates. Designed for high-end applications and with a low total cost of ownership Condura®.ultra maintains outstanding reliability.

Our team of experts will be on hand to provide insights, answer questions, and discuss how our products and innovations can benefit your business. 

Get detailed information during our live product presentations at our booth: 

Tuesday, May 6, 2025 at 11:00 a.m. 
Ag free Silicon Nitride AMB Substrates for Automotive Power Module Applications 
Olivier Mathieu, Product Manager Power Electronics  

Tuesday, May 6, 2025 at 2:00 p.m.
mAgic® PE360 - Paste properties for outstanding process robustness and durable interconnection between module and heat sink.
Florian Seifert, Product Manager Power Module Materials

Wednesday, May 7, 2025 at 11:00 a.m. 
FastLane - Boosting EU value chain for SiC power electronics
Dirk Brauer, Research & Innovation Director at Valeo eAutomotive Germany GmbH
Dr. Sebastian Fritzsche, Manager Technology Scouting at Heraeus Electronics GmbH & Co. KG 

Wednesday, May 7, 2025 at 2:00 p.m.
Heraeus Electronics Introduces the Next Generation Die Top System (DTS®)
Christian Kersting, Product Manager Power Wire

Thursday, May 8, 2025 at 11:00 a.m.  
Heraeus Electronics Introduces the Next Generation Die Top System (DTS®)
Christian Kersting, Product Manager Power Wire

Thursday, May 8, 2025 at 1:00 p.m.
Ag free Silicon Nitride AMB Substrates for Automotive Power Module Applications
Olivier Mathieu, Product Manager Power Electronics  

Or join us at the E-Mobility & Energy Storage Stage:  

Tuesday, May 6, 2025 at 12:30 p.m.  
Heraeus Electronics Introduces the Next Generation DTS®  
Christian Kersting, Product Manager Power Wire

Wednesday, May 7, 2025 at 12:55 p.m.  
Ag Free Silicon Nitride AMB Substrates for Automotive Power Module Applications
Olivier Mathieu, Product Manager Power Electronics  

Don't miss this opportunity to be at the forefront of technological advancement in Power Electronics. Let's meet in hall 6, booth 310 and embark on a journey towards a future of innovation and success together!