Heraeus Electronics is excited to introduce our latest innovation in Thermal management.
Discover Heraeus new TIM1 paste with 30 W/m·K thermal conductivity—ideal for AI, HPC,
and next-gen electronics.
"A high-performance TIM1 paste designed to deliver exceptional thermal conductivity,simplified processing, and long-term reliability for today’s most demanding applications"
Why Thermal Interface Materials Matter in AI & HPC
A Thermal Interface Material (TIM) is applied between heat-generating components (like silicon chips) and heat spreaders or heat sinks to ensure efficient heat transfer. The role of a TIM1—used directly between the die and lid—includes:
- Filling micro air gaps caused by surface roughness
- Enhancing heat dissipation
- Preventing component overheating
- Improving device reliability over time
However, selecting the ideal TIM1 isn't always straightforward. Engineers must navigate a variety of challenges and considerations.
Key Selection Criteria:
- High bulk thermal conductivity
- Low interfacial resistance
- Optimized bondline thickness (BLT)
- Strong adhesion to surfaces
- Low modulus for mechanical compliance
Common Challenges:
- Warpage in silicon and packaging affecting BLT uniformity
-
Air voids increasing thermal resistance
Trade-offs between physical properties like elongation, adhesion, and modulus.
Our Solution: A TIM1 Paste Engineered for Performance & Simplicity
To address these challenges head-on, Heraeus has developed a breakthrough TIM1 paste based on a composite polymer-silver technology that delivers industry-leading thermal performance without sacrificing process simplicity.
Key Features & Benefits:
- Outstanding Thermal Conductivity: Up to 30 W/m·K, supporting the intense thermal demands of AI and HPC processors
- No BSM Required: Strong adhesion properties eliminate the need for backside metallization (BSM), reducing process complexity
- Stress-Relieving Polymeric Matrix: Minimizes contact thermal resistance and absorbs mechanical stress, even at high temperatures
- Manufacturing Simplification: Fewer process steps and easy application make integration seamless
Whether you're working on next-gen data centers, AI accelerators, or high-frequency computing platforms, our TIM1 paste is engineered to help your devices stay cool, stable, and reliable—no matter the performance demand.
Join the Future of Thermal Management
At Heraeus Electronics, we’re committed to advancing innovation in materials science to meet the evolving needs of our customers. This TIM1 solution is just the beginning. Stay tuned as we expand our product portfolio to support the future of computing, connectivity, and smart technologies.
Want to learn more or get samples for testing?