Semiconductor Materials Blog:
Heraeus Electronics advances semiconductor innovation with SiP pastes, bonding wires, and lead-free silver sinter materials—all driven by commitment in R&D
Innovative Excellence: Advancing Semiconductor Materials from Singapore to the World
As the semiconductor industry accelerates toward higher performance, greater complexity, and more compact designs, advanced materials play an increasingly critical role in enabling next-generation devices. Heraeus Electronics—one of the world’s leading providers of materials solutions—continues to meet these challenges with a robust portfolio engineered for reliability, efficiency, and long-term performance.
Heraeus Singapore celebrated its 40th anniversary in August 2025. With its semiconductor materials R&D site in Singapore, the company underscores its decades-long commitment to innovation and collaboration in the region. Many of Heraeus Electronics’ most advanced solutions are developed at this site, reinforcing Singapore’s importance as a global innovation hub.
Welco™ Paste: Revolutionizing System-in-Package Technology
The latest Welco™ AP520 Type 7 paste exemplifies Heraeus Electronics’ leadership in materials for high-density System-in-Package (SiP) applications. Its uniquely engineered powders deliver ultra-low voiding and exceptional stability, minimizing cold joints and addressing warpage challenges on thin and complex substrates.
In photonics—particularly advanced retimed transceivers—Welco™ T7 pastes have demonstrated best-in-class performance. The product line serves key markets including mobile communications, AI data servers, automotive electronics, silicon photonics for networking and consumer electronics, where miniaturization and reliability are essential.
Gold Wires: The Benchmark for Memory Applications
For memory devices such as DRAM and flash memory, Heraeus Electronics gold bonding wires continue to set the industry benchmark. Their excellent conductivity, corrosion resistance, and mechanical strength support the high-speed data transmission required in advanced memory systems.
These wires are integral to data centres, computing systems, and consumer electronics, offering manufacturers a trusted solution for performance and long-term durability.
Vertical Bonding Wires: Solving Packaging-on-Packaging Challenges
As Packaging-on-Packaging (PoP) structures grow more complex, vertical interconnect reliability becomes crucial. Heraeus Electronics’ vertical bonding wires address alignment and spacing limitations, enabling robust electrical connections in extremely compact designs.
They streamline assembly, improve yield, and reduce production time—making them ideal for mobile devices, wearables, and IoT technologies.
AgCoat® Prime Wires: Cost-Effective Reliability for High-Volume Devices
Launched in 2019, AgCoat® Prime wires provide an advantageous combination of reliability and cost efficiency. With a silver core protected by a gold layer, these wires eliminate the need for forming gas while delivering strong conductivity and corrosion resistance.
They are particularly suited for smart cards, memory, and consumer electronics, supporting high-volume manufacturing without compromising performance.
Lead-Free Silver Sinter: mAgic® DA252 for Power Discrete Devices
With the semiconductor industry intensifying its focus on sustainability, Heraeus Electronics contributes through advanced, lead-free materials. The mAgic® silver sinter paste DA252 offers exceptional thermal and electrical conductivity and is engineered to withstand extreme operating conditions.
Its robust reliability makes it ideal for automotive power modules, renewable energy systems, and other power discrete applications, enabling greener and more efficient power electronics.
Celebrating 40 Years of Innovation in Singapore
As Heraeus Singapore marks its 40th anniversary in 2025, the company proudly recognises its Singapore R&D centre as the birthplace of many innovations across the semiconductor materials portfolio. This site remains vital in shaping the global roadmap for advanced packaging and power electronics solutions.
By combining global expertise with localized innovation, Heraeus Electronics continues to deliver materials that offer unmatched reliability, performance, and sustainability. As the semiconductor industry evolves, the company remains at the forefront—not only shaping the future of semiconductor materials but defining it.
