Die Top System (DTS®)
Up to over 50% increased die current capability and up to over 50 times longer lifespan
Enables junction temperatures of over 200°C, reducing power derating
Customizable configurations for optimal performance and reliability
Accelerated development processes and technical innovation
Simple and ready to use system for a fully sintered solution
Heraeus Electronics Die Top System (DTS®) - Get the Most out of your Power Module
Unlock next-level performance in power module lifetime and power density with Heraeus Electronics Die Top System (DTS®), your key to freedom from the constraints of conventional die interconnection. Transition to DTS® and embrace the extraordinary boost in durability and efficiency for your high-power applications.
DTS® is available in two variants to address different market needs
DTS® Gold: The trusted solution for exceptional performance in premium applications.
DTS® Silver: The innovative solution for cost-efficient, high-performance applications.
| Key Benefits | DTS® Gold | DTS® Silver |
|---|---|---|
| Significant reduction of power derating | ++ | ++ |
| Reduction of chip size | ++ | ++ |
| Increased lifetime vs. solder die attach and aluminum wire | ++ | + |
| Competitive cost of ownership and outstanding cost per Ampere ratio | + | ++ |
| One step sintering (chip front and back side) | ++ | ++ |
| Design flexibility | + | + |
| Shelf life | 6 months | 12 months |
| C02 footprint | o | ++ |
Grading system: excellent ++ / good + / okay o / complex -
Main Features of Heraeus Electronics Die Top System (DTS®)
Heraeus Electronics DTS® stands out by offering major advancements:
- Enhanced Performance and Reliability: Over 50% increase in die current capability and a lifetime more than 50x longer compared to solder die attach and aluminum wire bonding.
- Higher Junction Temperatures: Capable of exceeding 200°C, enabling less power derating and potential chip size reduction.
- Maximized Cost-Efficiency: Significant decrease in cost per ampere, optimizing both performance and profitability.
- Perfectly matched materials systems: PowerCu Soft bonding materials and DTS® are matched in properties for optimal performance enabling a large bonding window.
- DTS® with Pre-Applied Ag-Sinter Layer: Optimized compatibility with mAgic® pressure sinter pastes for die attach.
- Superior Flexibility: Outer dimensions are easily adaptable to all common chip designs.
- Simplified industrialization: Die and DTS® are sintered together in one step using standard sinter and die bonder equipment
Partner with Heraeus Electronics for Technical Excellence and Customization
Recognizing the need for precision and customization, Heraeus Electronics DTS® brings high technical expertise with tailored configurations to your specific requirements.
Our team supports you in finding the optimal configurations for your design, and our facility is well-equipped to test and perfect the match between all materials within the Die Top System to maximize both system performance and reliability.
By choosing Heraeus Electronics, you gain a partner with the capability to accelerate and refine your development process. Benefit from our vast experience and innovation, and rest assured that confidentiality and intellectual property rights are maintained, as outlined in our Declaration to Customers.
The Die Top System enables wide band gap semiconductors and future high temperature applications:
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Automotive - Power train H(EV)
- Traction
- Power conversion
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