mAgic® Pressure Sinter Pastes for Power Electronics

mAgic^® Sinter Paste PE340 is a next-generation silver pressure sinter paste engineered for high-performance die-attach in power electronic packages. Designed for precision and efficiency, its optimized rheology enables excellent flow behavior and high-resolution stencil printing—ensuring accurate deposition while reducing material consumption.

Based on microscale silver particles, mAgic^® PE340 supports fast and robust processing at low sintering conditions (below 230 °C, 15 MPa, 3 minutes), helping to increase throughput and lower energy costs. Its compatibility with bare copper surfaces eliminates the need for additional metallization steps, simplifying assembly and reducing total process complexity.

The lead-free, zero-halogen formulation aligns with modern environmental and regulatory requirements, making mAgic^® PE340 a future-ready solution for demanding applications such as automotive, industrial, and renewable energy systems.

• Delivers precise paste deposition for fine-feature applications.
• Supports material-efficient printing with strong process control. 
• Designed for compact package concepts and miniaturized layouts.
• Enables fast, streamlined pressure sintering in production.
• Integrates easily with bare copper surface designs. 
• Adapts to multiple assembly routes, from printing to dispensing.

The mAgic® PE338 Series by Heraeus offers a high-performance Ag sinter paste designed to meet the demanding requirements of power electronics applications. mAgic® PE338 Pressure Silver Sinter Paste is a lead-free die attach material with improved sinterability on copper surfaces. With its exceptional electrical and thermal properties, mAgic® PE338 provides increased lifetime, low thermal resistance, and elevated operation temperatures, making it suitable for various sectors like automotive, industrial, renewable energy, and aerospace.

• High thermal conductivity for longer lifetime
• High electrical conductivity improves device efficiency
• Enables high operating temperature
• Sintering on bare copper
• Consistent printing performance
• Workable for stencil printing, screen printing and jetting

mAgic® PE360 is designed to enter a new era in power electronics packages with enabling module attach sintering in almost any size.

mAgic® PE360 has an improved drying behaviour and reduced sintering parameters to tackle the key challenges in module attach sintering. Therefore, this paste maximizes efficiency and reliability and ensures the demanding requirements for future power modules.

• Enables maximum system performance
• High thermal conductivity and excellent reliability
• Low sintering parameters to protect sensitive power modules
• Workable for printing and slit nozzle dispensing application
• Wet placement process ready

Pressure Sinter Applications include: 

• Traction inverter for EVs

• Power Electronincs for New Energy and Industrial Applications