Solder Pastes
Wide Range of Solder Pastes Fitting your Application
Heraeus Electronics offers a wide range of solder pastes from no-clean to water soluble pastes ranging from type 3 to type 8 and beyond, with alloy types including but not limited to SAC305, ULA SAC305, high-reliability alloys, and low-temperature alloys. Alloy options are available with 100% recycled tin for significant carbon reduction.
Surface Mount Technology (SMT) Solder Paste
-
Wide Range of no-clean, halogen-zero products
-
Innolot® & HT1 for higher reliability assemblies
-
Type 3, 4 and 5 versions
Power Electronic Module Die Attach Solder Pastes
-
Outstanding low-voids performance
-
Minimal solder splashing
- Low tilt and rotation of dies
Die Attach Paste for Power Discrete
-
Multiple lead-containing, high-melting point alloys suiting to different device needs
-
Halogen zero and halogen-free formulation
-
Long worklife suitable for high-volume production environment
Advanced Packaging Solder Pastes and Fluxes
-
Welco fine-pitch (T5, T6, T7 and beyond) printing solder pastes
-
Fluxes for flip chip attach and BGA attach
-
Also available in 100% recycled tin version complying with RMI and ISO14021
Mini LED Solder Pastes and Fluxes
-
Welco fine-pitch (T5, T6, T7 and beyond) printing solder pastes
- High-tackiness flux for miniLED attach
