3571S

Description

3571S is a high performance silver conductor designed for cost sensitive hybrid applications. 3571S employs advanced powders technology with a mix bonded frit system to yield a highly dense fired film that is resistant to solder leaching. 3571S also exhibits excellent adhesion to Beryllium Oxide (BeO) substrates.

Key Features

Dense fired film Designed for cost sensitive hybrid applications Exhibits excellent adhesion to beryllium oxide substrates

Metal

Ag

Viscosity

180-240 Kcps Brookfield HBT SC4-14 spindle and 6R utility cup @ 10 rpm, 25°C

Coverage

70-75 cm 2/gm (Calculated from 50 micron wet film)

Coverage

70-75 cm 2/gm (Calculated from 50 micron wet film)

Storage and Paste Preparation

Store in a dry location at 5 – 25 °C

Warranty

6 months

Printing Parameters

200-325 stainless steel mesh screen 0.4 – 1.0 mil emulsion Allow parts to level at room temperature for 1 - 3 minutes before drying.

Printing Speed

Up to 10 in/sec (25 cm/sec)

Drying Temperature

150°C for 10 to 15 minutes

Process Temperature (TDS)

850°C peak temperature Dwell time of 5-10 minutes at peak Firing range of 850 - 925°C possible with minimal differences in properties

Film Thickness

9 - 15 μm