3571S is a high performance silver conductor designed for cost sensitive hybrid applications. 3571S employs advanced powders technology with a mix bonded frit system to yield a highly dense fired film that is resistant to solder leaching. 3571S also exhibits excellent adhesion to Beryllium Oxide (BeO) substrates.
Key Features
Dense fired film Designed for cost sensitive hybrid applications Exhibits excellent adhesion to beryllium oxide substrates
70-75 cm 2/gm (Calculated from 50 micron wet film)
Coverage
70-75 cm 2/gm (Calculated from 50 micron wet film)
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
200-325 stainless steel mesh screen 0.4 – 1.0 mil emulsion Allow parts to level at room temperature for 1 - 3 minutes before drying.
Printing Speed
Up to 10 in/sec (25 cm/sec)
Drying Temperature
150°C for 10 to 15 minutes
Process Temperature (TDS)
850°C peak temperature Dwell time of 5-10 minutes at peak Firing range of 850 - 925°C possible with minimal differences in properties