3571UF is an unfritted silver paste used primarily in multilayer applications as a top layer conductor to provide a glass free surface. 3571UF offers a dense fired film that exhibits excellent solderability.
Key Features
Pure Ag Conductor overprint
Enhances solderability
Excellent fired film density
Metal
Ag
Viscosity
180-240 Kcps Brookfield HBT
SC4-14 spindle and 6R utility cup @ 10 rpm, 25°C
Coverage
70-75 cm2/gm at 50 micron wet film thickness
Coverage
70-75 cm2/gm at 50 micron wet film thickness
Storage and Paste Preparation
Store in a dry location at 5 – 25 °C
Warranty
6 months
Printing Parameters
200-325 stainless steel mesh screen
0.5 mil emulsion
Allow parts to level at room temperature for 5-10 minutes.
Printing Speed
Up to 10 in/sec (25 cm/sec)
Drying Temperature
150°C for 10 to 15 minutes
Process Temperature (TDS)
850- 925°C peak temperature
Dwell time of 5-10 minutes at peak