3571UF is an unfritted silver paste used primarily in multilayer applications as a top layer conductor to provide a glass free surface. 3571UF offers a dense fired film that exhibits excellent solderability.
Key Features
Pure Ag Conductor overprint Enhances solderability Excellent fired film density
Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
200-325 stainless steel mesh screen 0.5 mil emulsion Allow parts to level at room temperature for 5-10 minutes.
Printing Speed
Up to 10 in/sec (25 cm/sec)
Drying Temperature
150°C for 10 to 15 minutes
Process Temperature (TDS)
850- 925°C peak temperature Dwell time of 5-10 minutes at peak