3610 is a gold conductor paste designed for microcircuit applications requiring aluminum wire bonds. 3610 is comprised of a mixed bond frit system that offers excellent aged wire bond adhesion for aluminum and gold wires. 3610 fires to a dense, pin-hole free film.
Key Features
Excellent Al and Au wire bondability
Dense fired film
Metal
Au
Viscosity
190-220 kcps, Brookfield HBT, SC4-14 spindle and
6R utility cap at 10 rpm, 25°C
Coverage
50-60 cm 2/gm
(Calculated from 50 micron wet film)
Coverage
50-60 cm 2/gm
(Calculated from 50 micron wet film)
Storage and Paste Preparation
Store in a dry location at 5 – 25 °C
Warranty
6 months
Printing Parameters
325 stainless steel mesh screens
0.3-0.5 mil emulsion
Allow parts to level at room temperature for 1-3 minutes
before drying.
Printing Speed
Up to 15 cm/sec (6 in/sec) _x000D_
Drying Temperature
150°C for 5-10 minutes.
Process Temperature (TDS)
850°C to 950°C peak temperature
Dwell time of 5-10 minutes at peak