5223
- Paste Type: Conductor
- Substrate: Glass
- Application Method: Brushing
- Application: Hybrid IC
Details
Description
5223 is a low firing fritted platinum/silver conductor paste. It exhibits excellent solderability on glass substrates.
Key Features
Low firing temperature
Excellent solderability
Excellent solderability
Metal
AgPt
Viscosity
23 – 28 kcps, Brookfield RVT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Drying Temperature
150 ºC for 15 minutes
Process Temperature (TDS)
600 – 650 ºC peak temperature
Dwell time 10 minutes at peak
Cycle time of 45 minutes
Dwell time 10 minutes at peak
Cycle time of 45 minutes