AB1
- Paste Type: Conductor
- Substrate: Glass
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
AB1 is a low temperature firing silver conductor paste. AB1 was designed for use on glass. The rheology has been formulated for screen printing.
Key Features
Low firing temperature
Good solderability
Low resistivity
Good solderability
Low resistivity
Metal
Ag
Viscosity
60 – 80 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @10 rpm, 25°C
Coverage
100 cm²/g at 12 μm fired film thickness
Coverage
100 cm²/g at 12 μm fired film thickness
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
165 – 280 mesh stainless steel screen0.5 mil emulsion
Drying Temperature
150 °C for 10 minutes
Process Temperature (TDS)
510 – 540 °C peak temperature
Dwell time of 3 – 4 minutes
Dwell time of 3 – 4 minutes
Film Thickness
Wet: 34 – 38 µmDried: 22 – 26 µmFired: 16 – 20 µm