AG-919
- Paste Type: Polymer Thick Film
- Substrate: PET / Polyimide / PC
- Application Method: Screen Printing
- Application: Simple Circuits
Details
Description
AG-919 is a silver-filled, electrically conductive ink designed for screen printing in flex circuits, membrane switches, heaters and other printed electronic applications. It can be printed as a thin base seed layer for plating processes.
Key Features
#Heat Stable to 170-200°C#Compatible for a wide variety of Printed and Hybrid electronic applications#Platable seed layer for decreasing resistance substantially#High adhesion levels to a variety of flexible plastics and rigid substrates#Maintains excellent bend capabilities for flexible applications
Metal
Ag
Viscosity
10 – 15 kcps, Brookfield, SC4-14 @ SR 20 , 25°C
Storage and Paste Preparation
Ambient storage, mix well prior to use.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
Polyester Mesh (157 to 230 TPI)
Steel Mesh (165 to 325 TPI)
Steel Mesh (165 to 325 TPI)
Drying Temperature
100-130°C
Film Thickness
8-20 µm DFT