C2130
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C2130 is a Pd/Ag composition designed for applications where more leach resistance is required. The C2130 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial circuits where more stringent requirements exist. It exhibits excellent solderability, aged adhesion properties and is aluminium wire bondable.
Key Features
Excellent solderability and leach resistance
Excellent long term adhesion
Good AI wire bond adhesion (initial and aged)
Excellent long term adhesion
Good AI wire bond adhesion (initial and aged)
Metal
AgPd
Viscosity
150 – 220 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup, @ 10 rpm, 25°C
Coverage
75 cm²/g at 12 μm fired film thickness
Coverage
75 cm²/g at 12 μm fired film thickness
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
280 – 325 mesh stainless steel screen
0.5 mil emulsion
Allow to level at room temperature for 5 – 10 minutes before
drying
Printing Sp
0.5 mil emulsion
Allow to level at room temperature for 5 – 10 minutes before
drying
Printing Sp
Printing Speed
Up to 7 in/sec
Drying Temperature
150 °C for 10 to 15 minutes
Process Temperature (TDS)
850 °C peak temperature10 minutes at peakTotal cycle time 30 – 60 minutes
Film Thickness
10 – 15 μm