C2130B

Description

C2130B is a Pd/Ag composition designed for applications where more leach resistance is required. The C2130B conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial circuits where more stringent requirementsexist. It exhibits excellent solderability, aged adhesion and is aluminum wire bondable.

Key Features

Excellent solderability and leach resistance
Excellent long term adhesion
Good AI wire bond adhesion (initial and aged)

Metal

AgPd

Viscosity

180 – 280 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Coverage

75 cm²/g at 12 μm fired film thickness

Coverage

75 cm²/g at 12 μm fired film thickness

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

280 – 325 mesh stainless steel screen
0.5 mil emulsion
Allow to level at room temperature for 5 – 10 minutes before
drying

Printing Speed

Up to 7 in/sec

Drying Temperature

150 °C for 10 to 15 minutes

Process Temperature (TDS)

850 °C peak temperature 10 minutes at peak Total cycle time 30 – 60 minutes

Film Thickness

Wet: 35 – 37 µm Fired: 10 – 15 µm